Metal nanopaste sintering bonding compatible vacuum soldering device
A new model of Shinko Precision's vacuum soldering device has arrived, enhancing the quality of metal sintering joints with excellent thermal uniformity, temperature rise characteristics, and atmosphere control. This is a next-generation high-reliability sintering bonding device.
The vacuum soldering equipment from Shinko Seiki, which supports the production of power device modules, has been upgraded. It improves the heating and cooling characteristics and expands the processing dimensions. It accommodates the sintering bonding of metal paste through the conventional atmosphere control performance and the increase in processing temperature. The realization of low oxygen concentration and the reducing power of a 100% hydrogen atmosphere significantly enhance the wettability by preventing the oxidation of wet paste. The addition of an optional heating and pressurizing mechanism also enables void-free bonding. Shinko Seiki's new vacuum soldering equipment is compatible with next-generation bonding materials.
